3/30/2021 0 Comments Spi Inspection Tools
The PS-230 SEM price is comparable to tabletop SEMs and offers better performance and capability.
Spi Inspection Tools Series SEM ProvidesThe PS series SEM provides 3nm resolution (30kV) which is the ultimate resolution for conventional tungsten SEMs.The user interface and navigation system allow non-experts to take quality images.![]() We focus on solutions such as MES solution, SMT solution and PCBA solution. If you are having trouble trying to locate a specific SPI Pin Gage Set, please email infohigherprecision.com, call 800-469-0132, or live chat with one of our technical support experts. We have over a decade of experience in the industry and can help you find the right SPI Pin Gage Set product for your specific measurement application. Not only do components vary considerably in size between batches, but also the colour and reflectivity. Solder Paste Inspection, SPI enables fast and accurate inspection of the solder paste on PCBs to ensure that the quality of paste on PCB are printed correctly and without manufacturing faults. The introduction of surface mount technology, and the subsequent further reductions in size mean that boards are particularly compact. Even relatively average boards have thousands of soldered joints, and these are where the majority of problems are found. ![]() With the marketplace now requiring high volume, high quality products to be brought to market very quickly very reliable and fast methods are needed to ensure that product quality remains high. SPI Solder Paste Inspection is an essential tool that ensure costs are kept as low as possible by detecting faults in the solder printing stage of production line. In this way they can be used to catch problems early in the production process. With faults costing more to fix the further along the production process they are found, this is obviously the optimum place to find faults. Additionally, process problems in the solder and assembly area can be seen early in the production process and information used to feedback quickly to earlier stages. In this way a rapid response can ensure that problems are recognized quickly and rectified before too many boards are built with the same problem. They are able to detect a variety of defects such as nodules, scratches and stains as well as the more familiar dimensional defects such as VolumeAreaHeightShapeShiftBridgeOverflow. As such they are able to perform all the visual checks performed previously by manual operators, and far more swiftly and accurately. The board is light by several light sources and one or more high definition cameras are used. In this way the SPI machine is able to build up a picture of solder paste on the board. Using this comparison the SPI system is able to detect and highlight any defects or suspect areas. Spi Inspection Tools Software Within TheThis captures an image of the printed circuit board, PCB assembly which is then analysed by the processing software within the SPI system. There are many variants of image capture system dependent upon the exact application and the complexity cost of the SPI system. The cameras should also be able to move under software control. This will enable them to move to the optimum position for a given PCB assembly. Speed against accuracy is a balance that has to be struck and will impact on the camera type used. The captured frame then enables a still image to be generated on which the signal processing is performed. This approach is not as accurate as other still image systems but has the advantage of very high speed. It may also be necessary to be able to move the camera under software control. As an important element of its task the SPI system also inspects the soldered joints to ensure they indicate that the joints are satisfactory.
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